Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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DELPHI COMPACT THERMAL MODEL GUIDELINE |
JESD15-4 | Oct 2008 |
This guideline specifies the definition and lists acceptable approaches for constructing a compact thermal model (CTM) based on the DELPHI methodology. The purpose of this document is twofold. First, it aims to provide clear guidance to those seeking to create DELPHI compact models of packages. Second, it aims to provide users with an understanding of the methodology by which they are created and validated, and the issues associated with their use. Committee(s):JC-15 Free download.Registrationorloginrequired. |
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GUIDELINE FOR MEASUREMENT OF ELECTRONIC PACKAGE INDUCTANCE AND CAPACITANCE MODEL PARAMETERS: |
JEP123 | Oct 1995 |
The need for this guideline arose from widespread lack of consistency in characterizing electrical parameters of electronic packages, which existed in the industry until the early 1990s. Then, the JEDEC Committee JC-15 provided the forum where various methods were discussed and commonality in approach emerged. The result is that today we have relatively consistent results in measuring and reporting electrical package parameters, as well as specialized tools (e.g., the IPA-510, the interconnect parameter analyzer) which were developed to support the methodology. Free download.Registrationorloginrequired. |
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GLOSSARY OF THERMAL MEASUREMENT TERMS AND DEFINITIONS |
JESD51-13 | Jun 2009 |
This document provides a unified collection of the commonly used terms and definitions in the area of semiconductor thermal measurements. The terms and definitions provided herein extend beyond those used in the JESD51 family of documents to include other often used terms and definitions in the area of semiconductor thermal measurements. Committee(s):JC-15 Free download.Registrationorloginrequired. |
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THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES |
JESD51-31 | Jul 2008 |
这个文档指定适当的modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared. Committee(s):JC-15 Free download.Registrationorloginrequired. |
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EXTENSION TO JESD51 THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES |
JESD51-32 | Dec 2010 |
This document addresses the need for extending the existing thermal test board standards to accommodate the potential of higher electrical connection needs of multi-chip packages (MCPs) and the associated wire routing to implement these connections. The extensions described in this standard are also applicable to single chip packages needing more than 36 electrical connections for the test. Committee(s):JC-15 Free download.Registrationorloginrequired. |