Global Standards for the Microelectronics Industry
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Displaying 1 - 5 of 5 documents.
Title | Document # | Date |
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GUIDELINE FOR MEASUREMENT OF ELECTRONIC PACKAGE INDUCTANCE AND CAPACITANCE MODEL PARAMETERS: |
JEP123 | Oct 1995 |
The need for this guideline arose from widespread lack of consistency in characterizing electrical parameters of electronic packages, which existed in the industry until the early 1990s. Then, the JEDEC Committee JC-15 provided the forum where various methods were discussed and commonality in approach emerged. The result is that today we have relatively consistent results in measuring and reporting electrical package parameters, as well as specialized tools (e.g., the IPA-510, the interconnect parameter analyzer) which were developed to support the methodology. Free download.Registrationorloginrequired. |
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ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements |
JEP181 | Sep 2020 |
This standard establishes the requirements for the exchange of electronic thermal system level simulation models between supplier and end user in a single neutral file format. The data is held in an XML format, conforming to an XML schema that this document describes. Committee(s):JC-15 Free download.Registrationorloginrequired. |
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ECXML Guidelines for Electronic Thermal System Level Models – XML Requirements Schema |
JEP181_Schema_R1p0 | Sep 2020 |
In conjunction with JEP181, for user support this file is the entire “XML Requirements Schema”. Committee(s):JC-15 Free download.Registrationorloginrequired. |
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Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-T100A | Mar 2023 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the mainJEP30 webpage. Committee(s):JC-11,JC-11.2,JC-15 Free download.Registrationorloginrequired. |
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PART MODEL SCHEMAS |
JEP30-10v3-0-0 | Aug 2023 |
This download includes all files under the parent schema JEP30-10v3-0-0 (Committees: JC-11, JC-11.2) including:
This will enable the user to validate the schemas. For more information visit the mainJEP30 webpage. Committee(s):JC-11,JC-11.2,JC-14,JC-15,JC-16 Free download.Registrationorloginrequired. |