Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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登记- Ceramic Quad Flatpack Family (CQFP), 0.50 mm Lead Pitch with Ceramic Nonconductive Tie Bar. Item 11.10-317. |
MO-134-A | May 1992 |
Patents(): National Semiconductor: 4,796,080 Committee(s):JC-11 |
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登记- Plastic Thin Fine Pitch Quad Flat, No Lead, Package. Registration of Quad, Single and Double Row SON Packages. The addition of 7 new thermal variations. Item 11.11-599. |
MO-208-C | Nov 2001 |
Committee(s):JC-11.11 |
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登记- Very Very Thin Quad Bottom Terminal Chip Carrier Family with Addition of variations AE, AF, AG, BE, BF, and BG. W-PBCC-B/WH-PBCC-B. Item 11.11-621. |
MO-217-B | Nov 2001 |
登记- New family of Thermally Enhanced Plastic Very Thin and Very Very Thin Pitch Bumped Quad Flat No Lead Packages. HP-VFQFP-NB, HP-WFQFP-NB. Item 11.11-679. |
MO-250-A | Nov 2003 |
登记- Thermally Enchanced Plastic Low and Thin Profile Fine Pitch Quad Flat No Lead Package. HLF-PQFPN, HTF-PQFPN. Item 11.11-686. |
MO-254-A | Feb 2004 |
登记- Plastic Fine Pitch Quad No-Lead Staggered Two Row Thermally Enhanced Package Family. H(U,V,W)F-PQFN. Item 11.11-707. |
MO-257-B | May 2005 |
Patents(): ASAT: 6,229,200; 6,242,281; 6,635,957; 6,498,099 |
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登记- Small Scale, Plastic, Ultra, Extra, and Super Thin, Fine Pitch, Quad Flat No Lead Package (with Optional Thermal Enhancements). (U, X1, X2)F-PQFN & H(U, X1, X2)F-PQFN. |
MO-288-B | Sep 2009 |
Item 11.11-821 |
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登记- Very Thin Fine Pitch Plastic Quad Flat Package, 2.00 mm Footprint. HVF-PQFP. |
MO-291-B | Dec 2008 |
Item 11.11-805 Patents(): Amkor: 6818973; 7211471 Committee(s):JC-11 |
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登记- Thermally Enhanced Plastic Very Thin Fine Pitch Quad Flat No Lead Package, includung Corner Terminals. HVF-PQFN. |
MO-265-A | Nov 2005 |
Item 11.11-722 |
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登记- Thermally Enhanced Plastic Ultra Thin and Extremely Thin Fine Pitch Quad Flat No Lead Package. H(U,X1)F-PQFP. |
MO-248-E | Jun 2006 |
Item 11.11-744. Patents(): Amkor, ASAT, National Semiconductor: See Outline |