Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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ELECTROSTATI经销商要求处理C -DISCHARGE SENSITIVE (ESDS) DEVICES: SUPERSEDED BY JESD42, March 1994.Status: Superseded |
JEP108-B | Apr 1991 |
Free download.Registrationorloginrequired. |
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GUIDELINES FOR THE MEASUREMENT OF THERMAL RESISTANCE OF GaAs FETS: |
JEP110 | Jul 1988 |
This publication is intended for power GaAs FET applications requiring high reliability. An accurate measurement of thermal resistance is extremely important to provide the user with knowledge of the FETs operating temperature so that more accurate life estimates can be made. FET failure mechanisms and failure rates have, in general, an exponential dependence on temperature (which is why temperature-accelerated testing is successful). Because of the exponential relationship of failure rate with temperature, the thermal resistance should be referenced to the hottest part of the FET. Committee(s):JC-14.7 Free download.Registrationorloginrequired. |
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GUIDELINES FOR USER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY SEMICONDUCTOR SUPPLIERS - SUPERSEDED BY JESD46, August 1997.Status: Rescinded |
JEP117 | Apr 1994 |
Committee(s):JC-14.4 Free download.Registrationorloginrequired. |
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GUIDELINES FOR GaAs MMIC PHEMT/MESFET AND HBT RELIABILITY ACCELERATED LIFE TESTING |
JEP118A | Dec 2018 |
These guidelines apply to GaAs Monolithic Microwave Integrated Circuits (MMICs) and their individual component building blocks, such as GaAs Metal-Semiconductor Field Effect Transistors (MESFETs), Pseudomorphic High Electron Mobility Transistors (PHEMTs), Heterojunction Bipolar Transistors (HBTs), resistors, and capacitors. While the procedure described in this document may be applied to other semiconductor technologies, especially those used in RF and microwave frequency analog applications, it is primarily intended for technologies based on GaAs and related III-V material systems (InP, AlGaAs, InGaAs, InGaP, GaN, etc). Committee(s):JC-14.7 Free download.Registrationorloginrequired. |
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GUIDELINES FOR THE PACKING, HANDLING, AND REPACKING OF MOISTURE-SENSITIVE COMPONENTS - SUPERSEDED BY J-STD-033, May 1999.Status: RescindedNovember 1999 |
JEP124 | Dec 1995 |
Committee(s):JC-14.4 Free download.Registrationorloginrequired. |