Global Standards for the Microelectronics Industry
Dictionary: JESD88
"A" limit
The more positive (less negative) limit of a range of some quantity.
References:JESD99B, 5/07
"B" limit
The less positive (more negative) limit of a range of some quantity.
References:JESD99B, 5/07
0-state
The logic state represented by the binary number 0 and usually standing for an inactive or false logic condition. (Ref. ANSI/IEEE Std 91.)
References:JESD99B, 5/07
1-state
The logic state represented by the binary number 1 and usually standing for an active or true logic condition. (Ref. ANSI/IEEE Std 91.)
References:JESD99B, 5/07
2-D code label (matrix)
A label that contains data in two dimensions as either stack or matrix types.
NOTEThis was originally published as “2D code label (matrix)”.
References:J-STD-609, 5/07
2-D code label (matrix)
A label that contains data in two dimensions as either stack or matrix types.
NOTEThis was originally published as “2D code label (matrix)”.
References:J-STD-609, 5/07
2ndlevel interconnect
的互连的附件device or component to the printed circuit board.
References:JESD97, 5/04
2ndlevel interconnect label
A label that identifies boxes, bags, or containers that contain boards, assemblies, or components having or capable of providing Pb-free 2nd‑level interconnects.
NOTE This label includes the Pb-free category and maximum processing temperature.
References:JESD97, 5/04
2nd level interconnect terminal finish/material
The material at the component 2nd level termination.
NOTEDepending on the component type, this material could refer to the terminal finish or ball material.
References:J-STD-609, 5/07
A
See "port A; port B".
References:A(n)
See "address inputs".
References:A-mode
See "acoustic data, A-mode"
References:A; a
See "anode terminal".
References:ABD array
A device having three or more terminals and containing multiple diodes within a single package,with at least one of the diodes being an ABD.
NOTEABD阵列可分为与μ1)设备ltiple discrete semiconductor chips; and 2) devices with multiple diode junctions diffused into a single semiconductor chip.
References:JESD77C, 10/09
JESD210, 12/07
absolute maximum rated junction temperature
The maximum junction temperature of an operating device, beyond which damage (latent or otherwise) may occur.
References:JESD22-A108C, 6/05
absolute maximum rated temperature
The maximum junction or ambient temperature of an operating device as listed in its data sheet and beyond which damage (latent or otherwise) may occur.
NOTE Manufacturers may also specify maximum case temperatures for specific packages.
References:JESD89-3, 9/05
absolute maximum rated voltage
The maximum voltage that may be applied to a device, beyond which damage (latent or otherwise) may occur.
References:JESD22-A108C, 6/05
JESD89-1, 6/04
JESD89-2, 11/04
JESD89-3, 9/05
