Global Standards for the Microelectronics Industry
Standards & Documents Search
Displaying 1 - 1 of 1 documents.
Title | Document # | Date |
---|---|---|
Mobile Platform Memory Module Thermal Sensor Component Specification |
MODULE4.7 | May 2022 |
Release No. 16.This replaces Release 15 and includes the following editorial changes: 1) Replaced master/slave with controller/target 2) Checked for presence of other sensitive words 3) Added Tables and Figures in Table of Contents(Release 15, Item 1640.07) Committee(s):JC-42.4 Free download.Registrationorloginrequired. |