Global Standards for the Microelectronics Industry
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Displaying 1 - 2 of 2 documents.
Title | Document # | Date |
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Design Requirements - Ball Grid Array Package (BGA) |
DR-4.27F.01 | Nov 2018 |
Ball Pitch = 0.65, 0.75 and 0.80 mm, Body sizes >21mm. (For body sizes ≤ 21mm see Design Registration 4.5) Item 11.2-969E. Editorial Change Committee(s):JC-11.2 Free download.Registrationorloginrequired. |
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Design Requirements - Ball Grid Array Package (BGA) and Interstitial Ball Grid Array Package (IBGA) |
DR-4.5N.01 | Nov 2018 |
Ball Pitch = 0.40, 0.50, 0.65, 0.75 and 0.80 mm. Body sizes = ≤ 21 mm.Item 11.2-968E, Editorial Change. Committee(s):JC-11.2 Free download.Registrationorloginrequired. |