Global Standards for the Microelectronics Industry
JEDEC Committee:
JC-42.4 Non-Volatile Memory Devices
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Recent Documents
NAND Flash Interface Interoperability | JESD230F.01 | May 2023 |
Secure Serial Flash Bus Transactions | JESD254 | Dec 2022 |
Serial NOR Security Hardware Abstraction Layer | JESD261 | Nov 2022 |
SERIAL FLASH DISCOVERABLE PARAMETERS (SFDP) | JESD216F.02 | Jun 2022 |
Definition of the EE1002 and EE1002A Serial Presence Detect (SPD) EEPROMs | SPD4.1.3-01 | May 2022 |
EXPANDED SERIAL PERIPHERAL INTERFACE (xSPI) FOR NONVOLATILE MEMORY DEVICES | JESD251C | May 2022 |
Mobile Platform Memory Module Thermal Sensor Component Specification | MODULE4.7 | May 2022 |
Definition of the TSE2002av Serial Presence Detect (SPD) EEPROM with Temperature Sensor (TS) for Memory Module Applications | SPD4.1.4-01 | May 2022 |
Definitions of the EE1004-v 4 Kbit Serial Presence Detect (SPD) EEPROM and TSE2004av 4 Kbit SPD EEPROM with Temperature Sensor (TS) for Memory Module Applications | SPD4.1.6-01 | May 2022 |
Addendum No. 1 to JESD251 - OPTIONAL x4 QUAD I/O WITH DATA STROBE | JESD251-1.01 | Sep 2021 |