Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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注册- P的托盘处理和运输GA Packages. Item 11.5-382 |
CO-010-E | Nov 1994 |
Free download.Registrationorloginrequired. |
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Registration - Ceramic Quad Flatpack Package (CQFP) Tray for Handling and Shipping. Item 11.5-259. |
CO-011-B | Mar 1990 |
Free download.Registrationorloginrequired. |
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Registration - Tray for Handling and Shipping of Metric Quad Flatpack (QFP) Packages. Variations AA-AE. Item 11.5-298/336. |
CO-012-C | Nov 1992 |
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注册- P的托盘处理和运输QFP Packages, 52, 68, 84, 100, 132, 164, 196 and 244 Pins. Variations AA-AG. Item 11.5-249 |
CO-015-B | Jan 1993 |
Free download.Registrationorloginrequired. |
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Registration - PLCC Tray for Handling and Shipping. Variations AA-AL. Item 11.5-281. |
CO-016-B | Feb 1991 |
Free download.Registrationorloginrequired. |
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Registration - Thin Matrix Mini Tray for Shipping and Handling. Item 11.5-427. |
CO-030-A | Oct 1995 |
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Registration - Thick Matrix Mini Tray For Shipping and Handling. Item 11.5-426. |
CO-031-A | Oct 1995 |
Free download.Registrationorloginrequired. |
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Registration - Thin Matrix Tray for Handling and Shipping Small Outline J- Lead Packages (SOJ). Item 11.5-446. |
CO-032-A | Jun 1996 |
Free download.Registrationorloginrequired. |
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Registration - Plastic Chip Carrier (PLCC) Shipping/Handling Tubes. Item 11.5-501. |
CO-033-A | Aug 1998 |
Free download.Registrationorloginrequired. |
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Registration - Addition of numerous N4 body sizes to variations AE and AF of Low Profile Matrix Tray for Handling and Shipping Thin Grid Array Devices Registration. Item 11.5-634. |
CO-034-D | Feb 2003 |
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Standard - Thin Matrix Tray for Handling and Shipping of Plastic Qual Flatpack Packages (PQFP). Variations AA-AG. Item 11.5-311. |
CS-002-A | Mar 1993 |
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Standard - Thin Matrix Tray for MQFP Shipping. Item 11.5-436S |
CS-004-B | Apr 1996 |
Free download.Registrationorloginrequired. |
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Standard - TSOP II, Thin Matrix Tray for Shipping and Handling of FBGA's. Item 11.5-519. |
CS-005-B | Nov 1998 |
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Standard - TSOP-I, Thin Matrix Tray for Shipping and Handling. Item 11.4-437S. |
CS-008-A | Mar 1996 |
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Registration - Thin Matrix Tray for Shipping and Handling of Ball Grid Packages. Includes Change to Note 18. Item 11.5-633 |
CO-029-H | Sep 2002 |
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Design Requirements - Generic Matrix Tray for Handling and Shipping, includes addition of optional side-wall bar code feature. |
DG-4.10D | Oct 2002 |
Item 11.2-615s Free download.Registrationorloginrequired. |
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Standard - Thin Matrix Tray for Handling and Shipping PLCC Packages. Variations AA-AL. Item 11.5-312. |
CS-003-B | Apr 1993 |
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JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING, AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES |
J-STD-033D | Apr 2018 |
The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe and damage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date. Free download.Registrationorloginrequired. |