Global Standards for the Microelectronics Industry
Standards & Documents Search
Title | Document # | Date |
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REGISTRATION - 288 PIN DDR5 DIMM SMT, 0.85 MM PITCH SOCKET OUTLINE |
SO-023D | May 2023 |
Designator: PDXC-LO288-I0p85-R162p0x6p5Z21p3-N5p20S3p1Z0p2Item: 11.14-216, AccessSTP Files for SO-023CCross Reference: MO-329, GS-010C Patents(): CN 202759077 U Committee(s):JC-11.14 Free download.Registrationorloginrequired. |
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Registration - Shipping and Handling Tray for M.2 Type 2230 Microelectronic Assembly |
CO-039A | Apr 2023 |
Designator: N/A Committee(s):JC-11.5 Free download.Registrationorloginrequired. |
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Registration - Shipping and Handling Tray for M.2 Type 2280 SSD Microelectronic Assembly |
CO-038A | Apr 2023 |
Designator: N/A Committee(s):JC-11.5 Free download.Registrationorloginrequired. |
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Registration - Plastic Quad Flat Package, Gull Wing and J-Lead, 0.65 MM Pitch |
MO-355A | Apr 2023 |
Designator: PQFP-E#_I0p65-R... Committee(s):JC-11.11 Free download.Registrationorloginrequired. |
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注册——塑料Bottom Grid Array, 0.80 MM Pitch, Rectangular Family Package |
MO-210R | Mar 2023 |
Designator: PBGA-B#[#]_I0p... Patents(): May apply: Micron: 6,048,753. Tessera: 5,950,304; and 6,133,627 Committee(s):JC-11.11 Free download.Registrationorloginrequired. |
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注册——塑料Bottom Grid Array Ball, 0.40 MM Pitch Rectangular Family Package |
MO-352A.01 | Mar 2023 |
Designator: PBGA-B#[#}_I0p4... Committee(s):JC-11.11 Free download.Registrationorloginrequired. |
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PART MODEL SCHEMAS |
JEP30-10v2-0-0 | Mar 2023 |
This download includes all files under the parent schema JEP30-10v2-0-0 (Committees: JC-11, JC-11.2) including:
This will enable the user to validate the schemas. For more information visit the mainJEP30 webpage. Committee(s):JC-11,JC-11.2,JC-14,JC-15,JC-16 Free download.Registrationorloginrequired. |
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Part Model Guidelines for Electronic-Device Packages – XML Requirements |
JEP30A | Mar 2023 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It covers several sub-sections such as electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the parental structure, under which several sub-section listed above, can be contained and linked together within the Part Model parent structure. For more information visit the mainJEP30 webpage. Free download.Registrationorloginrequired. |
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模型装配过程分类Guideli一部分nes for Electronic-Device Packages – XML Requirements |
JEP30-A100A | Mar 2023 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Assembly Process Classification” subsection of the Part Model. For more information visit the mainJEP30 webpage. Committee(s):JC-11,JC-11.2,JC-14.4 Free download.Registrationorloginrequired. |
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Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-E100A | Mar 2023 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, Electrical, assembly process classification data along with materials and substances that may be present in the supplied product or subproducts. This Guideline specifically focuses on the “Electrical” sub-section of the Part Model. For more information visit the mainJEP30 webpage. Committee(s):JC-11,JC-11.2,JC-16 Free download.Registrationorloginrequired. |
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Part Model Package Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-P100A | Mar 2023 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Package" subsection of the Part Model. For more information visit the mainJEP30 webpage. Free download.Registrationorloginrequired. |
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Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-T100A | Mar 2023 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, thermal, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the "Thermal" subsection of the Part Model. For more information visit the mainJEP30 webpage. Committee(s):JC-11,JC-11.2,JC-15 Free download.Registrationorloginrequired. |
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Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements |
JEP30-S100 | Mar 2023 |
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. This standard applies to all forms of electronic parts. It forms part of the Part Model XML Schema, which covers the parental structure for the electrical, physical, supply chain, assembly process classification data along with materials and substances that may be present in the supplied product or sub-products. This Guideline specifically focuses on the SupplyChain sub-section of the Part Model. For more information visit the mainJEP30 webpage. Committee(s):JC-11,JC-11.2,JC-14.4 Free download.Registrationorloginrequired. |
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注册——塑料Bottom Grid, Array Ball, 0.50 mm Pitch Rectangular Family |
MO-276T | Jan 2023 |
Designator: PBGA-B#[#]I0p5...Item 11-1027Cross Reference: DR4.5 Committee(s):JC-11.11 Free download.Registrationorloginrequired. |
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DESCRIPTIVE DESIGNATION SYSTEM FOR ELECTRONIC-DEVICE PACKAGES |
JESD30J | Nov 2022 |
This standard establishes requirements for the generation of electronic-device package designators for the JEDEC Solid State Technology Association. The requirements herein are intended to ensure that such designators are presented in as uniform a manner as practicable. Item 11.2-1002. Committee(s):JC-11.2 Free download.Registrationorloginrequired. |
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STANDARD - DDR5 262 Pin SODIMM Connector Performance Standard |
PS-006A | Oct 2022 |
This standard defines the form, fit and function of SODIMM DDR5 connectors for modules supporting channels with transfer rates 6.4 GT/S and beyond. It contains mechanical, electrical and reliability requirements for a one-piece connector mated to a module with nominal thickness of 1.20 mm. The intent of this document is to provide performance standards to enable connector, system designers and manufacturers to build, qualify and use the SODIMM DDR5 connectors in client and server platforms. Item 11.14-214S Committee(s):JC-11.14 Free download.Registrationorloginrequired. |
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STANDARD - DDR5 288 Pin U/R/LR DIMM Connector Performance Standard, DDR5 |
PS-005B | Oct 2022 |
This standard defines the form, fit and function of DDR5 connectors for U/R/LR modules supporting channels with transfer rates up to 6.4 GT/S. It contains mechanical, electrical and reliability requirements for connector mated to a module with nominal thickness of 1.27 mm. The intent of this document is to provide Performance Standards to enable connector, system designers and manufacturers to build, qualify and use the DDR5 connectors in client and server platforms. Item 11.14-213S Committee(s):JC-11.14 Free download.Registrationorloginrequired. |
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注册——塑料Bottom Grid Array Ball, 0.80 mm X 0.65 mm Pitch Rectangular Family Package |
MO-311F | Oct 2022 |
Designator: PBGA-B#[#]_I0p65... Committee(s):JC-11.11 Free download.Registrationorloginrequired. |
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Registration - Plastic Multi Connector 32 Pin, 1.00 MM Pitch 19.35 MM x 21.00 MM Socket |
SO-031A | Aug 2022 |
Item 11.14-209ADesignator: PMXC-G32[39]_1p0-R19p35x21p0Z3p2-N23p4T# Committee(s):JC-11.14 Free download.Registrationorloginrequired. |
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注册——塑料Bottom Grid Array Ball, 0.75 MM x 0.73 MM Pitch Rectangular Family Package |
MO-353A | Aug 2022 |
Item 11-993Designator: PBGA-B#[#]_I0p73... Committee(s):JC-11.11 Free download.Registrationorloginrequired. |