ARLINGTON, VA., USA – MARCH 12, 2023 – JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced an expansion of its CAMM standardization activity to include stackable CAMMs and support of LPDDR5.

This standard defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL™-attached memory modules.The purpose is to provide certain reference base targets for CXL™-attached memory modules to enable system design simplification, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.

The following labels shall be applied to all CXL memory modules to fully describe the key attributes of the module. The label can be in the form of a stick-on label, silk screened onto the assembly, or marked using an alternate customer-readable format.

This annex JESD309-S4-RCE, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.

This annex JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw CardC Annex defines the design detail of x16, 1 Package Ranks DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.

This standard describes the serial presence detect (SPD) values for all DDR5 memory modules. In this context, “modules” applies to memory modules like traditional Dual In-line Memory Modules (DIMMs) or solder-down motherboard applications. The SPD data provides critical information about all modules on the memory channel and is intended to be used by the system's BIOS in order to properly initialize and optimize the system memory channels.

This standard for labels applies to all DDR5 memory modules to fully describe the key attributes of the module. The label can be in the form of a stick-on label, silk screened onto the assembly, or marked using an alternate customer-readable format, Item 2268.02C

ARLINGTON, Va. – December 16, 2021– JEDEC Solid State Technology Association announced today that Bill Gervasi, Principal Systems Architect, Nantero, has been presented with the JEDEC Award of Excellence. Given by the JEDEC Board of Directors, the Award of Excellence is the most prestigious technical award bestowed by the Association and recognizes an individual’s sustained service to JEDEC and the standards community.

This standard defines the functional requirements of Backup Energy Module (BEM), henceforth referred to as BEM in this standard. This module shall be used to provide backup power to the Industry Defined Storage Array Controller Cards and NVDIMM-n as applicable. All standards are applicable under all operating conditions unless otherwise stated. Item 2279.03

ARLINGTON, Va., USA – February 17, 2021 – JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD304-4.01 DDR4 NVDIMM-P Bus Protocol. The JEDEC NVDIMM-P standard will enable the industry to create advanced memory solutions that benefit from the enhanced system performance and novel data availability offered by Persistent Memory devices.

This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 6. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. Item 2220.01H.

ARLINGTON, Va., USA – October 13, 2020 – JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of JESD403-1 JEDEC Module Sideband Bus standard (“SidebandBus”). SidebandBus was developed in coordination with the MIPI^Ò Alliance as both a subset and superset of the MIPI I3C Basic^SM serial bus standard. SidebandBus defines the parameters for usage of the system management control bus for the

This standard defines the assumptions for the system management bus for next generation memory solutions; covering the interface protocol, use of hub devices, and voltages appropriate to these usages. Item 2260.56A.

ARLINGTON, Va., USA – SEPTEMBER 10, 2019 – JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of document release 5 of the 188亚博 . With this release of the document, the revision level of all memory types increases to UDIMM (revision 1.2), RDIMM (revision 1.3), LRDIMM (revision 1.4) and NVDIMM (revisio

This annex describes the serial presence detect (SPD) values for all DDR4 modules covered in Document Release 5. Differences between module types are encapsulated in subsections of this annex. These presence detect values are those referenced in the SPD standard document for ‘Specific Features’. Item 2276.05.

This section covers DDR3 DIMM labels.

This section covers DDR2 DIMM labels.

This standard provides the labels for the DDR Series DIMMs.